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TB2922HQ
TOSHIBA Bi-CMOS Digital Integrated Circuit Silicon Monolithic
TB2922HQ
Dual Audio Power Amplifier
The TB2922HQ is 2ch BTL audio amplifier for TV or home audio applications. It includes and the pure complementary P-ch and N-ch DMOS output stage. The package is CPP (Compact Power Package). It is built-in standby function, muting function various kinds of protectors. Weight: 4.04 g (typ.)
Features
* : : : : * * * * * * * High power output POUT (1)= 22 W (typ) (VCC = 18V, RL = 8 , f = 1 kHz, THD = 10%) POUT (2)= 37W (typ) (VCC = 16V, RL = 4 , f = 1 kHz, THD = 10%) POUT (3)= 46W (typ) (VCC = 26V, RL = 8 , f = 1 kHz, THD = 10%) POUTMAX (1)= 72W (typ) (VCC = 26V, RL = 8 , f = 1 kHz, ax Power) Low distortion ratio Low noise : THD=0.02 (typ) : Vno = 0.16 Vrms (typ) (VCC = 18V, RL = 8 , Rg = 0 , BW = 20 Hz~20 kHz)
Low outside parts Built-in standby switch function (pin 1) Built-in muting function (pin 6) Built-in various protection circuits: Thermal shut down, overvoltage, out to GND, out to VCC, out to out short speaker burned Operating supply voltage : VCC (opr) = 9 to 26 V (RL = 8 ) : VCC (opr) = 9 to 18 V (RL = 4 )
Note 1: Install the device correctly. Otherwise, the device or system may be degraded, damaged or even destroyed. Note 2: The protection features are intended to avoid output short-circuits or other abnormal conditions temporarily. It is not guaranteed that they will prevent the IC from being damaged. Exposure to conditions beyond the guaranteed operating ranges may not activate the protection features, resulting in an IC damage due to output short-circuits. Note 3: If HBM ESD(condition; 100pF/1.5k) of under -1900V is applied to pin 2 or pin 4 in case that pin3 is GND, this product may break down.
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Block Diagram
C5
7 VCC2 OUT1 (+) 4 IN1 8
C1
OUT1 (-)
9
OUT2 (+) 2 IN2
12 RL
C1
OUT2 (-)
11
PRE-GND
3 RIP 5 C2 STBY PW-GND MUTE 10 1 6 R2 C4 R1 5V PLAY MUTE : PRE-GND : PW-GND
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purpose.
C3 RL
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Caution and Application Method (Description is made only on the single channel)
1. Voltage Gain Adjustment
This IC has no NF (negative feedback) Pins. Therefore, the voltage gain can not be adjusted, but it makes the device a space and total costs saver.
Amp. 2A Amp. 1 Input
Amp. 2B
Figure 1
Block Diagram
The voltage gain of amp.1 : GV1 = 8dB The voltage gain of amp.2A, B : GV2 = 20dB The voltage gain of BTL connection : GV (BTL) = 6dB Therefore, the total voltage gain is decided by expression below. GV = GV1 + GV2 + GV (BTL) = 8 + 20 + 6 = 34dB
2.
Standby SW Function (pin 1)
By means of controlling pin 1 (standby pin) to High and Low, the power supply can be set to ON and OFF. The threshold voltage of pin 1 is set at about 3 VBE (typ.), and the power supply current is about 2 A (typ.) in the standby state.
VCC ON Power OFF 1 10 k 2 VBE to BIAS CUTTING CIRCUIT
Control Voltage of Pin 4: VSB
Stand-by ON OFF Power OFF ON VSB (V) 0 to 0.5 2.5 to 6
When changing the time constant of pin 1, check the pop noise.
Figure 2 With pin 1 set to High, Power is turned ON
Advantage of Standby SW
(1) (2) Since VCC can directly be controlled to ON or OFF by the microcomputer, the switching relay can be omitted. Since the control current is microscopic, the switching relay of small current capacity is satisfactory for switching.
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Large current capacity switch Battery Relay Battery
VCC
VCC - Conventional Method -
From microcomputer
Small current capacity switch Battery
From microcomputer Battery
Stand-By VCC
Stand-By VCC - Standby Switch Method -
Figure 3
3. Muting Function (pin 6)
Audio muting function is enabled when pin 6 is Low. When the time constant of the muting function is determined by R1 and C4, it should take into account the pop noise. The pop noise, which is generated when the power or muting function is turned ON/OFF, will vary according to the time constant. (Refer to Figure4) The pin 6 is designed to operate off 5 V so that the outside pull-up resistor R1 is determined on the basic of this value: ex) When control voltage is changed in to 6 V from 5 V. 6 V/5 V x 47 k = 56 k Additionally, as the VCC is rapidly falling, the IC internal low voltage muting operates to eliminate the large pop noise basically. The low voltage muting circuit pull 200 A current into the IC so that the effect of the internal low voltage muting does not become enough if the R1 is too small value. To obtain enough operation of the internal low voltage muting, a series resistor, R1 at pin 6 should be 47 k or more.
5V 1 k Mute ON/OFF control
R1
6 C4
Figure 4
Muting Function 4 2007-02-20
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4. Pop Noise Suppression
The pop noise which is generated when the muting function is turned ON/OFF will vary according to the time constant of C4. The greater the capacitance, the lower the pop noise. Note that the time from when the mute control signal is applied to C4 to when the muting function is turned ON/OFF will be longer.
5. External Component Constants
Component Recommended Name Value 0.22 F 10 F 0.1 F Effect Purpose Lower than recommended value Cut-off frequency is increased Powering ON/OFF is faster Higher than recommended value Cut-off frequency is reduced Powering ON/OFF takes longer
C1 C2
To eliminate DC To reduce ripple To provide sufficient oscillation margin To reduce pop noise Ripple filter
C3
Reduces noise and provides sufficient oscillation margin High pop noise. Duration until Low pop noise. Duration until muting function is turned muting function is turned ON/OFF is short ON/OFF is long Power supply ripple filtering
C4 C5
1 F 3900 F
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Absolute maximum ratings (Ta = 25C)
Characteristics DC supply voltage Operation supply voltage Power dissipation Operation temperature Storage temperature Symbol VCC (DC) VCC (opr) PD (Note 4) Topr Tstg Rating 28 26 62.5 -40 to 85 -55 to 150 Unit V V W C C
Note 4: Package thermal resistance j-T = 2C/W (typ.) (Ta = 25C, with infinite heat sink) The absolute maximum ratings of a semiconductor device are a set of specified parameter values, which must not be exceeded during operation, even for an instant. If any of these rating would be exceeded during operation, the device electrical characteristics may be irreparably altered and the reliability and lifetime of the device can no longer be guaranteed. Moreover, these operations with exceeded ratings may cause break down, damage and/or degradation to any other equipment. Applications using the device should be designed such that each absolute maximum rating will never be exceeded in any operating conditions. Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set forth in this documents.
Electrical Characteristics
Characteristics Quiescent current
(unless otherwise specified, VCC = 18 V, f = 1 kHz, RL = 8 , Ta = 25C)
Symbol ICCQ POUT (1) Output power POUT (2) POUT (3) POUT MAX (1) Total harmonic distortion Voltage gain Voltage gain ratio Output noise voltage Ripple rejection ratio Cross talk Output offset voltage Input resistance Standby current Standby control voltage THD GV GV VNO R.R. C.T. VOFFSET RIN ISB VSB H VSB L Mute control voltage VM H VM L Mute attenuation ATT M Test Circuit VIN = 0 THD = 10% THD = 10%, RL=4 VCC = 26 V, THD = 10% VCC = 26V, Max POWER POUT = 4 W VOUT = 0.775 Vrms VOUT = 0.775 Vrms Rg = 0 , BW = 20 Hz~20 kHz frip = 100 Hz, Rg = 620 Vrip = 0.775 Vrms Rg = 620 VOUT = 0.775 Vrms Standby condition POWER: ON POWER: OFF MUTE: OFF MUTE: ON, R1 = 47 k MUTE: ON VOUT = 10 VrmsMute: OFF Test Condition Min 21 32 -1.0 40 -250 2.5 0 2.5 0 85 Typ. 80 22 37 46 72 0.02 34 0 180 50 65 0 30 1 100 Max 150 0.20 36 1.0 250 250 10 6.0 V 0.5 6.0 V 0.5 dB % dB dB Vrms dB dB mV k A W Unit mA
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Test Circuit
1000F C5 7 VCC2 OUT1 (+) 0.22 F C1 4 IN1 8
0.1F C3 RL RL 5V PLAY MUTE : PRE-GND : PW-GND
OUT1 (-)
9
OUT2 (+) 0.22 F C1 2 IN2
12
OUT2 (-)
11
PRE-GND
3 RIP 5 C2 STBY PW-GND MUTE 10 1 6 10F C4 R2 1 k R1 1F 47 k
Components in the test circuits are only used to obtain and confirm the device characteristics. These components and circuits do not warrant to prevent the application equipment from malfunction or failure.
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THD - POUT
100 VCC = 18 V 50 30 RL = 8 Filter 100 Hz : to 30 kHz 10 5 3 1kHz : 400 Hz to 30 kHz
8 (ch1)
100 50 30 VCC = 18 V RL = 8 Filter
THD - POUT 8 (ch2)
100 Hz : to 30 kHz 1kHz 10 5 : 400 Hz to 30 kHz 10 kHz : 400 Hz to 20 kHz : 400 Hz to
10 kHz : 400 Hz to 20 kHz : 400 Hz to
(%)
3
(%)
Total harmonic distortion THD
1 0.5 0.3
20 kHz
Total harmonic distortion THD
1 0.5 0.3
20 kHz 10 kHz
10 kHz
0.1 0.05 0.03 1 kHz
0.1 0.05 0.03
1 kHz
0.01 f = 100 Hz 0.005 0.003
0.01 0.005 0.003
f = 100 Hz
0.001 0.1
0.3 0.5
1
3
5
10
30 50
100
0.001 0.1
0.3 0.5
1
3
5
10
30 50
100
Output power
POUT
(W)
Output power
POUT
(W)
THD - POUT
100 50 30 VCC = 18 V RL = 4 Filter 100 Hz : to 30 kHz 10 5 1kHz : 400 Hz to 30 kHz 10 kHz : 400 Hz to 20 kHz : 400 Hz to
4 (ch1)
100 50 30 RL = 4 Filter
THD - POUT
VCC = 18 V
4 (ch2)
100 Hz : to 30 kHz 1kHz 10 5 : 400 Hz to 30 kHz 10 kHz : 400 Hz to 20 kHz : 400 Hz to
(%)
3 20 kHz 1 0.5 0.3 10 kHz
Hz to 30 kHz to to
(%)
3 20 kHz 1 0.5 0.3 10 kHz
Total harmonic distortion THD
0.1 0.05 0.03 f = 100 Hz 0.01 0.005 0.003 1 kHz
Total harmonic distortion THD
0.1 0.05 0.03
1 kHz
f = 100 Hz 0.01 0.005 0.003
0.001 0.1
0.3 0.5
1
3
5
10
30 50
100
0.001 0.1
0.3 0.5
1
3
5
10
30 50
100
Output power
POUT
(W)
Output power
POUT
(W)
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THD - POUT (ch1)
100 RL = 8 50 f = 1 kHz 30 Filter 400 Hz to 30 kHz 10 5 VCC = 9 V 18 V 26 V 10 5 100 RL = 8 50 f = 1 kHz
THD - POUT (ch2)
30 Filter 400 Hz to 30 kHz
VCC = 9 V
18 V 26 V
(%)
3
(%)
3
Total harmonic distortion THD
1 0.5 0.3
Total harmonic distortion THD
1 0.5 0.3
0.1 0.05 0.03
0.1 0.05 0.03
0.01 0.005 0.003
0.01 0.005 0.003
0.001 0.1
0.3 0.5
1
3
5
10
30 50
100
0.001 0.1
0.3 0.5
1
3
5
10
30 50
100
Output power
POUT
(W)
Output power
POUT
(W)
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muteATT - f
0 VCC = 18 V 3 RL = 8 VOUT = 10 Vrms (22.5dBm) VCC = 18 V 1 RL = 8 POUT = 4 W 0.3 0.1 2 ch No filter
THD - f
Mute attenuation muteATT (dB)
-20
-40
-60
Total harmonic distortion THD
(%)
0.03 0.01 1 ch 0.003 0.001 0.01
-80
-100
1 ch~2 ch
-120 10
100
1k
10 k
100 k
0.1
1
10
100
frequency f
(Hz)
frequency f
(Hz)
GV - f
40 1 ch~2 ch 0 VCC = 13.2 V
R.R. - f
(dB)
RL = 4 Vrip = 0.775 Vrms (0dBm) -20
GV (dB)
30
Ripple rejection ratio
R.R.
20 -40
Voltage gain
2 ch -60 1 ch
10 VCC = 18 V RL = 8 VOUT = 0.775 Vrms (0dBm) 0 0.01 0.1 1 10 100
-80 0.01
0.1
1
10
100
frequency f
(Hz)
frequency f
(Hz)
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VIN - POUT (ch1)
40 1 kHz f = 100 Hz 40
VIN - POUT (ch2)
1 kHz
f = 100 Hz 10 kHz
(W)
30
(W)
10 kHz 20 kHz
30 20 kHz
Output power POUT
20
Output power POUT
20
10 VCC = 18 V RL = 8 No filter 0 0 2 4 6 8
10 VCC = 18 V RL = 8 No filter 0 0 2 4 6 8
Input voltage
VIN
(Vrms)
Input voltage
VIN
(Vrms)
ICCQ - VCC
RL =
PD MAX - Ta
(W)
30 1: Infinite heat sink 1 25 2: 4.1C/W heat sink 3: 9.5C/W heat sink
80 VIN = 0 V 60
(mA)
Allowable power dissipation PD MAX
ICCQ
20 2 15 3 10
Quiescent Current
40
20
5
0 0
5
10
15
20
25
30
0 0
25
50
75
100
125
150
175
200
Supply voltage
VCC
(V)
Ambient temperature Ta (C)
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C.T. - f
0
VNO - Rg
300
Cross talk C.T. (dB)
-20
Output noise voltage VNO
(Vrms)
200
VCC = 18 V RL = 8 VOUT = 0.775 Vrms (0dBm) RG = 620
-40 CT (2-1) -60 CT (1-2) -80 10
1ch~2ch
100
VCC = 18 V RL = 8 Filter: ~20 kHz
100
1k
10 k
100 k
0 10
100
1k
10 k
100 k
frequency f
(Hz)
Signal source resistance Rg
()
PD - POUT
40 0 f = 1 kHz RL = 8 2ch drive 30
(W)
26 V
Power dissipation PD
20
22 V
18 V 10
VCC = 9.0 V 00 10 20 30 40 50
Output power
POUT
(W)
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Package Dimensions
Weight: 4.04 g (typ.)
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* Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. * If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. For details on how to connect a protection circuit such as a current limiting resistor or back electromotive force adsorption diode, refer to individual IC datasheets or the IC databook. IC breakdown may cause injury, smoke or ignition. * Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. * Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. * Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. * Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the Thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. * Heat Radiation Design When using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. * Installation to Heat Sink Please install the power IC to the heat sink not to apply excessive mechanical stress to the IC. Excessive mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of internal IC chip. In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of silicon rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation design and heat sink installation, refer to individual technical datasheets or IC databooks.
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About solderability, following conditions were confirmed * Solderability (1) Use of Sn-63Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux
RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
030619EBF
* The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations. * This product generates heat during normal operation. However, substandard performance or malfunction may cause the product and its peripherals to reach abnormally high temperatures. The product is often the final stage (the external output stage) of a circuit. Substandard performance or malfunction of the destination device to which the circuit supplies output may cause damage to the circuit or to the product.
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